kit inspection - определение. Что такое kit inspection
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Что (кто) такое kit inspection - определение

Automated Optical Inspection; Automated inspection

sponge bag         
ARTICLE OF LUGGAGE
Dopp; Dopp kit; Dop Kit; Dopp Kit; Toilet bag; Toilet-bag; Washbag; Dob kit; Dopp bag; Body hygene kit; Wash bag; Toiletry kit; Travel kit; Body hygiene case; Dop kit; Sponge bag; Body hygiene kit; Bathroom bag
¦ noun Brit. a toilet bag.
Pipeline video inspection         
  • Semi-rigid ''fish'' may be pushed through the pipe to fetch a rope
  • Tractor with motor and cradle for the inspection head
  • 175px
Pipeline video inspection is a form of telepresence used to visually inspect the interiors of pipelines, plumbing systems, and storm drains. A common application is for a plumber to determine the condition of small diameter sewer lines and household connection drain pipes.
toilet bag         
ARTICLE OF LUGGAGE
Dopp; Dopp kit; Dop Kit; Dopp Kit; Toilet bag; Toilet-bag; Washbag; Dob kit; Dopp bag; Body hygene kit; Wash bag; Toiletry kit; Travel kit; Body hygiene case; Dop kit; Sponge bag; Body hygiene kit; Bathroom bag
¦ noun Brit. a waterproof bag for holding toothpaste, soap, etc. when travelling.

Википедия

Automated optical inspection

Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.

Historically, the primary place for AOI systems has been after solder re-flow or "post-production." Mainly because, post-re-flow AOI systems can inspect for most types of defects (component placement, solder shorts, missing solder, etc.) at one place in the line with one single system. In this way the faulty boards are reworked and the other boards are sent to the next process stage.